Sensing devices

ABSTRACT

The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No.PCT/CN2021/106947, filed on Jul. 16, 2021, the contents of which arehereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to sensors, more particularly, relates toa sensing device with at least one convex structure arranged on a film.

BACKGROUND

A sensing device is one of commonly used detection devices, whichconverts an acquired sensing signal into an electrical signal orinformation of other required forms for output through its internalenergy conversion component. The sensitivity represents a ratio of anintensity of an output signal of the sensing device to an intensity ofan input signal. If the sensitivity is too small, user experiences willbe affected. When the sensing device works, the sensitivity of thesensing device relates to the volume and a volume change of a sensingcavity of the sensing device.

The present disclosure provides a sensing device, which may not onlyimprove the reliability, but also the sensitivity of the sensing deviceeffectively.

SUMMARY

A sensing device, comprising: an elastic component; a sensing cavity,wherein the elastic component forms a first sidewall of the sensingcavity; and an energy conversion component configured to obtain asensing signal and convert the sensing signal into an electrical signal,the energy conversion component being in communication with the sensingcavity, and the sensing signal relating to a change of a volume of thesensing cavity, wherein at least one convex structure is arranged on oneside of the elastic component facing toward the sensing cavity, theelastic component driving the at least one convex structure to move inresponse to an external signal, and the movement of the at least oneconvex structure changing the volume of the sensing cavity.

In some embodiments, the at least one convex structure abuts against asecond sidewall of the sensing cavity, and the second sidewall isopposite to the first sidewall.

In some embodiments, the at least one convex structure has elasticity,when the at least one convex structure moves, the at least one convexstructure producing elastic deformation, and the elastic deformationchanging the volume of the sensing cavity.

In some embodiments, the at least one convex structure is arranged on atleast part of a surface of the elastic component in an array.

In some embodiments, a shape of the at least one convex structureincludes at least one of a pyramid shape, a hemispherical shape, or astriped shape.

In some embodiments, an interval between a pair of adjacent convexstructures of the at least one convex structure is 1 μm-2000 μm.

In some embodiments, an interval between a pair of adjacent convexstructures of the at least one convex structure is 10 μm-500 μm.

In some embodiments, a height of each of the at least one convexstructure is 1 μm-1000 μm.

In some embodiments, a height of each of the at least one convexstructure is 10 μm-300 μm.

In some embodiments, the elastic component includes an elastic film andan elastic microstructure layer, and the at least one convex structureis arranged on the elastic microstructure layer.

In some embodiments, the elastic microstructure layer and the elasticfilm are made of a same material.

In some embodiments, the elastic microstructure layer and the elasticfilm are made of different materials.

In some embodiments, a thickness of the elastic film is 0.1 μm-500 μm.

In some embodiments, a thickness of the elastic film is 1 μm-200 μm.

In some embodiments, a difference between a height of each of the atleast one convex structure and a height of the sensing cavity is within10%

In some embodiments, the sensing device further comprising: a mass unitarranged on a surface of the other side of the elastic component, themass unit and the elastic component vibrating together in response tothe external signal; and a shell accommodating the elastic component,the mass unit, the sensing cavity, and the energy conversion component.

In some embodiments, the energy conversion component is an acoustictransducer.

In some embodiments, the elastic component is arranged above theacoustic transducer, and the sensing cavity is formed between theelastic component and the acoustic transducer.

In some embodiments, an outer edge of the elastic component is fixedlyconnected with the acoustic transducer through a sealing component, andthe elastic component, the sealing component, and the acoustictransducer jointly form the sensing cavity.

In some embodiments, an outer edge of the elastic component is fixedlyconnected with the shell, and the elastic component, the shell, and theacoustic transducer jointly form the sensing cavity.

In some embodiments, a thickness of the mass unit is 1 μm-1000 μm.

In some embodiments, a thickness of the mass unit is 50 μm-500 μm.

In some embodiments, a resonance frequency of a resonant system formedby the mass unit and the elastic component is 1500 Hz-6000 Hz.

In some embodiments, a resonance frequency of a resonant system formedby the mass unit and the elastic component is 1500 Hz-3000 Hz.

In some embodiments, the sensing device further comprising: anotherelastic component, the another elastic component and the elasticcomponent being arranged on two sides of the mass unit symmetrically,and the another elastic component being fixedly connected with theshell.

A sensing element, comprising: an elastic component; and a first sensingcavity, wherein the elastic component forms a first sidewall of thefirst sensing cavity, wherein at least one convex structure is arrangedon one side of the elastic component facing toward the first sensingcavity, the elastic component driving the at least one convex structureto move in response to an external signal, and the movement of the atleast one convex structure changing a volume of the first sensingcavity.

In some embodiments, the sensing element is attached to a transducer,the transducer is placed opposing the elastic component to form a closedsensing cavity, and the transducer converts a volume change of theclosed sensing cavity into an electrical signal.

A vibration sensing device, comprising: an elastic vibration component,including a diaphragm; an acoustic transducer, wherein an acousticcavity is formed between the diaphragm and the acoustic transducer, theacoustic cavity being configured to obtain a sensing signal and convertthe sensing signal into an electrical signal, and the sensing signalrelating to a change of a volume of the acoustic cavity, wherein atleast one convex structure is arranged on one side of the diaphragmfacing toward the acoustic cavity, the elastic vibration componentdriving the at least one convex structure to move in response to anexternal signal, and the movement of the at least one convex structurechanging the volume of the acoustic cavity.

A sensing element, comprising: an elastic component; and a sensingcavity, wherein the elastic component forms a first sidewall of thesensing cavity; wherein at least one convex structure is arranged on oneside of the elastic component facing toward the sensing cavity, andYoung's modulus of the at least one convex structure is 100 kPa-1 mPa,the elastic component causing at least one of movement and deformationof the at least one convex structure in response to an external signal,and the at least one of the movement and deformation of the at least oneconvex structure changing the volume of the sensing cavity.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is further illustrated in terms of exemplaryembodiments. These exemplary embodiments are described in detail withreference to the drawings. These embodiments are non-limiting exemplaryembodiments, in which like reference numerals represent similarstructures throughout the several views of the drawings, and wherein:

FIG. 1 is a schematic diagram illustrating an exemplary structuralmodule diagram of a sensing device according to some embodiments of thepresent disclosure;

FIG. 2 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure;

FIG. 3A is a schematic diagram illustrating an exemplary section of aconvex structure abutting against a second sidewall of a sensing cavityaccording to some embodiments of the present disclosure; FIG. 3B isanother schematic diagram illustrating an exemplary section of the atleast one convex structure abutting against the second sidewall of thesensing cavity according to some embodiments of the present disclosure;

FIG. 4 is a structural schematic diagram illustrating at least oneconvex structure according to some embodiments of the presentdisclosure;

FIG. 5 is a structural schematic diagram illustrating at least oneconvex structure according to some other embodiments of the presentdisclosure;

FIG. 6 is a structural schematic diagram illustrating at least oneconvex structure according to yet other embodiments of the presentdisclosure;

FIG. 7 is a schematic diagram illustrating an exemplary sensing deviceaccording to some other embodiments of the present disclosure;

FIG. 8 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure;

FIG. 9 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure;

FIG. 10 is a schematic diagram illustrating an exemplary connectionbetween a sensing element and a shell according to some embodiments ofthe present disclosure;

FIG. 11 is a schematic diagram illustrating an exemplary simplifiedmechanical model of the system composed of an elastic component and amass unit according to some embodiments of the present disclosure;

DETAILED DESCRIPTION

In order to illustrate the technical solutions relates to theembodiments of the present disclosure, brief introduction of thedrawings referred to in the description of the embodiments is providedbelow. Obviously, drawings described below are only some examples orembodiments of the present disclosure. Those having ordinary skills inthe art, without further creative efforts, may apply the presentdisclosure to other similar scenarios according to these drawings. Itshould be understood that the exemplary embodiments are provided merelyfor better comprehension and application of the present disclosure bythose skilled in the art, and not intended to limit the scope of thepresent disclosure. Unless obviously obtained from the context or thecontext illustrates otherwise, the same numeral in the drawings refersto the same structure or operation.

As used in the disclosure and the appended claims, the singular forms“a,” “an,” and “the” include plural referents unless the content clearlydictates otherwise. In general, the terms “comprise,” “comprises,”and/or “comprising,” “include,” “includes,” and/or “including,” merelyprompt to include steps and elements that have been clearly identified,and these steps and elements do not constitute an exclusive listing. Themethods or devices may also include other steps or elements. The term“based on” is “based at least in part on.” The term “one embodiment”represents “at least one embodiment”; The term “another embodiment”represents “at least one other embodiment.” Related definitions of otherterms may be given in the description below.

Some embodiments of the present disclosure relate to a sensing device.The sensing device may include an elastic component, a sensing cavity,and an energy conversion component. The elastic component forms a firstsidewall of the sensing cavity. The energy conversion component may beconnected to the sensing cavity, the energy conversion component may beconfigured to obtain a sensing signal and convert it into an electricalsignal, the sensing signal may relate to a volume change of the sensingcavity. Sensitivity of the sensing device may increase with the decreaseof volume of the sensing cavity and with the increase of the volumechange. At least one convex structure may be arranged on one side of theelastic component facing toward the sensing cavity, the at least oneconvex structure may reduce the volume of the sensing cavity to increasethe sensitivity of the sensing device. In some embodiments, the at leastone convex structure may be configured to abut against a second sidewallof the sensing cavity, when the sensing device is in a working state,the elastic component may drive the at least one convex structure tovibrate and be squeezed by the second sidewall of the sensing cavity,resulting in elastic deformation. When the at least one convex structuregenerates an elastic deformation, the volume change of the sensingcavity may be improved, so as to improve the sensitivity of the sensingdevice. In addition, the existence of the at least one convex structuremay effectively reduce a contact area between the elastic component andthe second sidewall of the sensing cavity, so it may prevent adhesionwith the second sidewall forming the sensing cavity, and effectivelyimprove the stability and reliability of the sensing device.

FIG. 1 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure. The sensingdevice 10 may acquire an external signal and generate a required signal(e.g., an electrical signal) based on the external signal. The externalsignal may include a mechanical vibration signal, an acoustic signal, anoptical signal, an electrical signal, or the like. A type of the sensingdevice 10 may include, but are not limited to, a pressure sensingdevice, a vibration sensing device, a tactile sensing device, or thelike. In some embodiments, the sensing device 10 may be applied to amobile device, a wearable device, a virtual reality device, an augmentedreality device, or the like, or any combination thereof. In someembodiments, the mobile device may include a smartphone, a tablet, apersonal digital assistant (PDA), a game device, a navigation device, orthe like, or any combination thereof. In some embodiments, a wearabledevice may include a smart bracelet, a headphone, a hearing aid, a smarthelmet, a smartwatch, an intelligent garment, a smart backpack, a smartaccessory, or the like, or any combination thereof. In some embodiments,a virtual reality device and/or an augmented reality device may includea virtual reality helmet, a pair of virtual reality glasses, a virtualreality patch, an augmented reality helmet, a pair of augmented realityglasses, an augmented reality patch, or the like, or any combinationthereof. For example, a virtual reality device and/or an augmentedreality device may include Google Glass, Oculus Rift, Hololens, Gear VR,or the like.

As shown in FIG. 1 , the sensing device 10 may include an elasticcomponent 20, an energy conversion component 30, a shell 40, and asensing cavity 50. An interior of the shell 40 may have an accommodationspace for accommodating at least one component of the sensing device 10.For example, the shell 40 may accommodate the elastic component 20 andother components (e.g., a mass unit 260 and a sealing unit 270 shown inFIG. 2 ). In some embodiments, the shell 40 may be connected with othercomponents of the sensing device 10 (e.g., the elastic component 20,convertible components 30, etc.) to form the accommodation space. Forexample, in the embodiment as shown in FIG. 2 , a shell 240 may beconnected with an energy conversion component 230 to form anaccommodation space 241.

In some embodiments, the shell 40 may be in different shapes. Forexample, the shell 40 may be arranged as a cube, a cuboid, anapproximate cuboid (for example, a structure in which eight corners ofthe cuboid are replaced by arcs), an ellipsoid, a sphere, or any othershapes.

In some embodiments, the shell 40 may be made of a material with acertain hardness or strength, so that the shell 40 may protect thesensing device 10 and its internal elements (e.g., the elastic component20). In some embodiments, the materials for making the shell 40 mayinclude but are not limited to, a printed circuit board (PCB) material(such as FR-1 phenolic paper substrate, FR-2 phenolic paper substrate,FR-3 epoxy paper substrate, FR-4 epoxy glass cloth substrate, CEM-1epoxy glass cloth paper composite board, CEM-3 epoxy glass cloth—glassboard, etc.), Acrylonitrile butadiene styrene copolymer (ABS),Polystyrene (PS), High impact polystyrene (HIPS), Polypropylene (PP),Polyethylene terephthalate (PET), Polyester (PES), Polycarbonate (PC),Polyamides (PA), Polyvinyl chloride (PVC), Polyurethanes (PU),Polyvinylidene chloride, Polyethylene (PE), Polymethyl methacrylate(PMMA), Poly-ether-ether-ketone (PEEK), Phenolics (PF),Urea-formaldehyde (UF), Melamine formaldehyde (MF), metals or alloys(such as aluminum alloys, chromium-molybdenum steels, scandium alloys,magnesium alloys, titanium alloys, magnesium-lithium alloys, nickelalloys, etc.), glass fibers or carbon fibers, or the like, or anycombination thereof. In some embodiments, the materials for making theshell 40 may be any combination of glass fibers, carbon fibers, PC, PA,or other materials. In some embodiments, the materials for making theshell 40 may be a mixture of carbon fibers and PC in certainproportions. In some embodiments, the materials for making the shell 40may be a mixture of carbon fibers, glass fibers, and PC in certainproportions. In some embodiments, the materials for making the shell 40may be made of glass fibers and PC mixed in certain proportions, orglass fibers and PA mixed in certain proportions.

The sensing cavity 50 may be arranged inside the sensing device 10. Thesensing cavity 50 may relate to a sensing signal obtained by the energyconversion component 30. The sensing cavity 50 may be a closed orsemi-closed cavity formed by one or more components of the sensingdevice 10. In some embodiments, the sensing cavity 50 may be a closed orsemi-closed cavity formed by the elastic component 20 and othercomponents. For example, the sensing cavity 50 may be a closed cavityformed by the elastic component 20, the energy conversion component 30,and the shell 40. The sensing cavity 50 may have a certain volume, andan interior of the sensing cavity 50 may be filled with gas. The gas maybe a gas with stable properties (for example, a gas that is not easy toliquefy, burn or explode). For example, the gas may include air,nitrogen, inert gas, or the like.

When the sensing device 10 works, the volume of the sensing cavity 50may change. The sensing cavity 50 may include at least two oppositesidewalls. The two opposite sidewalls may include a first sidewall and asecond sidewall. When the sensing device 10 works, the first sidewall(or part of structures arranged on the first sidewall) and/or the secondsidewall (or part of structures arranged on the second sidewall) of thesensing cavity 50 may have relative displacement(s), resulting in achange in the volume of the sensing cavity 50. In some embodiments, thefirst sidewall and/or the second sidewall may be composed of one or morecomponents of the sensing device 10. For example, the first sidewall maybe composed of the elastic component 20 or one or more elements/unitsthereof. The second sidewall may be composed of the energy conversioncomponent 30 or one or more elements/units thereof. For example, duringthe operation of the sensing device 10, the elastic component 20 (or amicrostructure, such as at least one convex structure, arranged on asurface (also known as an inner surface) of the elastic component 20facing toward the sensing cavity 50) forming the first sidewall of thesensing cavity 50 and/or the energy conversion component 30 forming thesecond sidewall of the sensing cavity 50 may move (for example, as arelative motion due to inconsistent response of the first sidewall andthe second sidewall to a vibration) relatively when driven by anexternal vibration signal, and a distance between inner surfaces of thefirst sidewall and the second sidewall may change, thereby changing thevolume of the sensing cavity 50.

The energy conversion component 30 refers to an element capable ofobtaining a sensing signal and converting the sensing signal into arequired signal. The sensing signal may include an acoustic signal. Insome embodiments, the energy conversion component 30 may convert thesensing signal into an electrical signal. For example, the energyconversion component 30 may convert an acoustic signal (e.g., a soundpressure) into an electrical signal. As another example, the energyconversion component 30 may convert a mechanical vibration signal intoan electrical signal. The energy conversion component 30 may be incommunication with the sensing cavity 50 and obtain the sensing signal.For example, a surface of the energy conversion component 30 orelement/units (e.g., the element used to obtain the sensing signal inthe energy conversion component 30) of the energy conversion component30 may be used as the second sidewall of the sensing cavity 50. Theenergy conversion component 30 may be in communication with the interiorof the sensing cavity 50 and obtain the sensing signal. The sensingsignal may relate to one or more parameters of the sensing cavity 50.The one or more parameters may include a cavity height, a volume size, avolume change, an air pressure, or the like. In some embodiments, thesensing signal may relate to a volume change of the sensing cavity 50.Merely by way of example, when the volume of the sensing cavity 50changes, an air pressure of a gas (e.g., air) filled in the sensingcavity 50 may change. An element used to obtain the sensing signal inthe energy conversion component 30 may obtain the air pressure changeand generate a corresponding electrical signal. In some embodiments, theenergy conversion component 30 may be an acoustic transducer. Forexample, the energy conversion component 30 may be an air conductingmicrophone (also known as an air conduction microphone). The airconduction microphone may obtain a sound pressure change of the sensingcavity 50 and convert the sound pressure change into an electricalsignal.

The elastic component 20 may vibrate or elastically deform (the elasticcomponent 20 has a certain elasticity) in response to an external signal(e.g., a vibration). As mentioned above, the elastic component 20 mayform the first sidewall of the sensing cavity 50. When the elasticcomponent 20 vibrates or elastically deforms, a position of the innersurface of the first sidewall may change. In some embodiments, theposition of the second sidewall of the sensing cavity 50 may remainfixed or substantially fixed. At this time, the distance between theinner surface of the first sidewall and the inner surface of the secondsidewall may change relatively, and the volume of the sensing cavity 50may change (assuming that the sidewall between the first sidewall andthe second sidewall remains relatively fixed). In some embodiments, theposition of the second sidewall of the sensing cavity 50 may alsochange. For example, both the second sidewall and the first sidewall ofthe sensing cavity 50 may vibrate. If a vibration phase of the secondsidewall is different from a vibration phase of the first sidewall, thedistance between the inner surface of the first sidewall and the innersurface of the second sidewall may change relatively, and the volume ofthe sensing cavity 50 may change (assuming that the sidewall between thefirst sidewall and the second sidewall remains relatively fixed). Asanother example, both the second sidewall and the first sidewall of thesensing cavity 50 have elastic deformations. If an elastic deformationof the second sidewall is different from an elastic deformation of thefirst sidewall, the distance between the inner surface of the firstsidewall and the inner surface of the second sidewall may changerelatively, and the volume of the sensing cavity 50 may change (assumingthat the sidewall between the first sidewall and the second sidewallremains relatively fixed).

Exemplarily, the elastic component 20 and the energy conversioncomponent 30 or elements/units thereof (e.g., elements in the energyconversion component 30 for obtaining the sensing signal) may form thefirst sidewall and the second sidewall of the sensing cavity 50,respectively. The external signal may be a mechanical vibration. Themechanical vibration may be transmitted to the energy conversioncomponent 30 and the elastic component 20 through the shell 40. Inresponse to the mechanical vibration, both the energy conversioncomponent 30 and the elastic component 20 may vibrate. Due to differentvibration phases of the energy conversion component 30 and the elasticcomponent 20, the distance between the inner surfaces of the firstsidewall and the second sidewall may change, and the volume of thesensing cavity 50 may change.

In some embodiments, at least one convex structure 23 (e.g., a convexstructure 223 shown in FIG. 2 ) may be arranged on an inner surface(i.e., the surface facing toward the sensing cavity 50) of the elasticcomponent 20. The at least one convex structure 23 may be arranged on atleast part of an area on the inner surface of the elastic component 20.In some embodiments, the at least one convex structure 23 may bearranged on the entire inner surface of the elastic component 20. Insome embodiments, the at least one convex structure 23 may be arrangedon a part of the inner surface of the elastic component 20. In someembodiments, a ratio of an area occupied by the at least one convexstructure 23 to the area of the inner surface of the elastic component20 may be less than three-quarters. In some embodiments, the ratio of anarea occupied by the at least one convex structure 23 to the area of theinner surface of the elastic component 20 may be less than two-thirds.In some embodiments, the ratio of an area occupied by the at least oneconvex structure 23 to the area of the inner surface of the elasticcomponent 20 may be less than one-half. In some embodiments, the ratioof an area occupied by the at least one convex structure 23 to the areaof the inner surface of the elastic component 20 may be less thanone-third. In some embodiments, the ratio of an area occupied by the atleast one convex structure 23 to the area of the inner surface of theelastic component 20 may be less than one-quarter. In some embodiments,the ratio of an area occupied by the at least one convex structure 23 tothe area of the inner surface of the elastic component 20 may be lessthan one-fifth. In some embodiments, the ratio of an area occupied bythe at least one convex structure 23 to the area of the inner surface ofthe elastic component 20 may be less than one-sixth. Exemplary, theinner surface of the elastic component 20 may be divided into a centralpart and a peripheral part. The at least one convex structure 23 may bearranged on the peripheral part, while the central part may have noconvex structure 23. A ratio of an area occupied by the peripheral partto the area of the inner surface of the elastic component 20 may be lessthan three-quarters, two-thirds, one-half, one-third, one-quarter,one-fifth, one-sixth, or the like.

The at least one convex structure 23 may be arranged on the innersurface of the elastic component 20 uniformly or non-uniformly. In someembodiments, the at least one convex structure 23 may be arranged in anarray on the inner surface of the elastic component 20. For example,adjacent convex structures 23 may be spaced on the inner surface of theelastic component 20 at a regular interval. In some embodiments, thedistribution of the at least one convex structure 23 on the innersurface of the elastic component 20 may be uneven. For example, aninterval between a pair of adjacent convex structures 23 may change withthe position of the adjacent convex structures 23.

The at least one convex structure 23 may have a specific shape. In someembodiments, the specific shape may include a regular shape such as apyramid shape, a hemispherical shape, a stripe shape, a ladder shape, acylindrical shape, or the like. In some embodiments, the specific shapemay be any irregular shape.

For a conventional elastic component that does not include the at leastone convex structure 23, which may be used as the first sidewall of thesensing cavity 50, the first sidewall of the sensing cavity 50 mayadhere to the second sidewall of the sensing cavity 50 (e.g., the energyconversion component 30) during the vibration due to a large vibrationamplitude, resulting in a failure of the sensing device 10. Theexistence of the at least one convex structure 23 may effectively reducethe contact area between the elastic component 20 and the secondsidewall of the sensing cavity 50, thus preventing the adhesion of thefirst sidewall to the second sidewall of the sensing cavity 50 andimproving the stability and reliability of the sensing device 10effectively.

The at least one convex structure 23 may affect the sensitivity of thesensing device 10. The sensitivity may be an important parameterreflecting the performance of the sensing device 10. The sensitivity maybe understood as an amplitude of a response of the sensing device 10 toa specific external signal during operation. For the sensing device 10,the energy conversion component 30 may be in a fluid communication withthe sensing cavity 50. The sensing signal obtained by the energyconversion component 30 relates to the volume change of the sensingcavity 50. The sensitivity of the sensing device 10 may relate to avolume size and/or a volume change of the sensing cavity 50. For a sameexternal signal, the greater the volume change of the sensing cavity 50,the greater the response of the sensing device 10 may be, andaccordingly, the higher the sensitivity of the sensing device 10 may be;the smaller the volume of the sensing cavity 50 may be, the greater theresponse of the sensing device 10, and accordingly, the higher thesensitivity of the sensing device 10 may be. Therefore, the sensitivityof the sensing device 10 may vary by changing the volume of the sensingcavity 50 and/or an amount of the change in the volume of the sensingcavity 50 during the operation of the sensing device 10. Since the atleast one convex structure 23 protrudes into the interior of the sensingcavity 50 and occupies a part of the volume of the sensing cavity 50,the volume of the sensing cavity 50 is smaller than that when theelastic component 20 of the at least one convex structure 23 is notprovided, so that the sensing device 10 may have a higher sensitivity.

In some embodiments, the at least one convex structure 23 may have acertain elasticity. Since the at least one convex structure 23 iselastic, the at least one convex structure 23 may generate elasticdeformation when pressed by an external force. In some embodiments, theat least one convex structure 23 may abut against the second sidewall ofthe sensing cavity 50 (e.g., the surface of the energy conversioncomponent 30 or one or more of its components). When the at least oneconvex structure 23 abuts against the second sidewall of the sensingcavity 50, the vibration of the elastic component 20 may drive the atleast one convex structure 23 to move. At this time, the at least oneconvex structure 23 may be squeezed by the second sidewall of thesensing cavity 50, resulting in the elastic deformation of the at leastone convex structure 23. The elastic deformation may cause the at leastone convex structure 23 to protrude further into the sensing cavity 50and reduce the volume of the sensing cavity 50. Therefore, the volumechange of the sensing cavity 50 may be further improved, so as toimprove the sensitivity of the sensing device 10. More details about theat least one convex structure and how the at least one convex structureimproves the sensitivity of the sensing device may be found elsewhere inthe present disclosure. See, for example, FIGS. 2 to 6 and thedescriptions thereof, which will not be repeated here.

In some embodiments, the elastic component 20 may include an elasticfilm 21. The at least one convex structure 23 may be arranged on asurface (i.e., the inner surface) of the elastic film 21 facing towardthe sensing cavity 50. In some embodiments, the material for making theelastic film 21 may include polymer materials such as polyimide (PI),polydimethylsiloxane (PDMS), polytetrafluoroethylene (PTFE), or thelike. For more details about the elastic film may be found elsewhere inthe present disclosure, for example, FIG. 2 , FIG. 7 , and thedescriptions thereof, which will not be repeated here.

The above description of the sensing device 10 is merely a specificexample and should not be regarded as the only feasible embodiment.Obviously, for those skilled in the art, after understanding the basicprinciple of the sensing device 10, various modifications and changes inform and detail may be made to the specific methods and steps ofimplementing the sensing device 10 without departing from thisprinciple, but these modifications and changes are still within thescope described above. In some embodiments, the sensing device 10 mayinclude one or more other components, such as a mass unit (the mass unit260 shown in FIG. 2 ), a sealing unit (the sealing unit 270 shown inFIG. 2 ), or the like, or any combination thereof. In some embodiments,a plurality of components of the sensing device 10 may be combined intoa single component. For example, the mass unit may be integrated on theelastic component 20 to form a resonant system with the elasticcomponent 20. The resonant system vibrates in response to an externalsignal. In some embodiments, a component of the sensing device 10 may besplit into one or more subcomponents. For example, the elastic component20 may be divided into an elastic film (the elastic film 721 shown inFIG. 7 ) and an elastic microstructure layer (the elastic microstructurelayer 725 shown in FIG. 7 ). The at least one convex structure 23 may bearranged on the elastic microstructure layer.

FIG. 2 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure. In the presentembodiment, the sensing device 210 may be a vibration sensing device.The vibration sensing device may acquire a vibration signal and convertthe vibration signal into an electrical signal. For example, the sensingdevice 210 may be part of a microphone, such as a bone conductionmicrophone (also known as a bone conduction microphone). The boneconduction microphone may convert a vibration signal into a voicesignal. For example, the bone conduction microphone may acquire avibration signal generated by the facial muscle when a user speaks, andconvert the vibration signal into an electrical signal containing voiceinformation.

As shown in FIG. 2 , the sensing device 210 may include an elasticcomponent 220, an energy conversion component 230, a shell 240, a massunit 260, and a sealing unit 270. The shell 240 may have theaccommodation space 241 for accommodating one or more components of thesensing device 210 (e.g., the elastic component 220, the mass unit 260,and the sealing unit 270). In some embodiments, the shell 240 may be asemi-closed shell, which may be connected with the energy conversioncomponent 230 to form the accommodation space 241. For example, theshell 240 may be set above and cover the energy conversion component 230to form the accommodation space 241.

In some embodiments, the sensing device 210 shown in FIG. 2 may beapplied to the field of microphones as a vibration sensing device, suchas a bone conduction microphone. For example, when applied to a boneconduction microphone, the sensing cavity 250 may also be referred to asan acoustic cavity, and the energy conversion component 230 may be anacoustic transducer. The acoustic transducer may obtain a sound pressurechange of the acoustic cavity and convert the sound pressure change ofthe acoustic cavity into an electrical signal. In some embodiments, theelastic component 220 is arranged above the acoustic transducer (i.e.,the energy conversion component 230), and a sensing cavity 250 is formedbetween the elastic component 220 and the acoustic transducer.

The elastic component 220 may include an elastic film 221. At least oneconvex structure 223 is arranged on a surface (also known as an innersurface) of the elastic film 221 close to the energy conversioncomponent 230. The at least one convex structure 223 and the elasticfilm 221 (forming a first sidewall of the sensing cavity 250) may formthe sensing cavity 250 together with the energy conversion component 230(forming a second sidewall of the sensing cavity 250). For a vibrationsensing device, the sensing cavity 250 may also be referred to as anacoustic cavity. The elastic film 221 may also be referred to as adiaphragm.

As shown in FIG. 2 , an outer edge of the elastic film 221 may bephysically connected with the energy conversion component 230. Thephysical connection may include a bonding connection, a nailingconnection, a clamping connection, and a connection through additionalconnecting components (e.g., the sealing unit 270). For example, theouter edge of the elastic film 221 may be bonded with the energyconversion component 230 by an adhesive to form the sensing cavity 250.However, the sealing performance of the adhesive bonding is poor, whichreduces the sensitivity of the sensing device 210 to a certain extent.In some embodiments, the top of the at least one convex structure 223abuts against the surface of the energy conversion component 230. Thetop refers to end(s) of the at least one convex structure 223 away fromthe elastic film 221. A connection between the top of the at least oneconvex structure 223 arranged on the periphery of the elastic film 221and the surface of the energy conversion component 230 may beimplemented by the sealing unit 270, so that the at least one convexstructure 223, the elastic film 221, the sealing unit 270 and the energyconversion component 230 may form a closed sensing cavity 250 together.It can be understood that a position of the sealing unit 270 is notlimited to the above descriptions. In some embodiments, the sealing unit270 may be arranged not only at the connection between the top of the atleast one convex structure 223 and the surface of the energy conversioncomponent 230, but also on peripheries (i.e., one side of the at leastone convex structure 223 away from the sensing cavity 250) of the atleast one convex structure 223 for forming the sensing cavity 250. Insome embodiments, in order to further improve the sealing performance, asealing structure may also be arranged inside the sensing cavity 250. Byimplementing the connection between the elastic component 220 and theenergy conversion component 230 through the sealing unit 270, thesealing performance of the entire sensing cavity 250 may be ensured, andthe reliability and stability of the sensing device 210 may beeffectively improved. In some embodiments, the sealing unit 270 may bemade of silica gels, rubbers, and other materials to further improve thesealing performance of the sealing unit 270. In some embodiments, thetype of sealing unit 270 may include one or more of a sealing ring, asealing gasket, and a sealant strip.

In some embodiments, the elastic film 221 may have a certain thickness,and the thickness of the elastic film 221 refers to a size of theelastic film 221 in the first direction. For the convenience ofunderstanding, the thickness of the elastic film 221 may be representedby H3 in FIG. 2 . In some embodiments, the thickness H3 of the elasticfilm 221 may be within a range of 0.1 μm-500 μm. In some embodiments,the thickness H3 of the elastic film 221 may be within a range of 0.2μm-400 μm. In some embodiments, the thickness H3 of the elastic film 221may be within a range of 0.4 μm-350 μm. In some embodiments, thethickness H3 of the elastic film 221 may be within a range of 0.6 μm-300μm. In some embodiments, the thickness H3 of the elastic film 221 may bewithin a range of 0.8 μm-250 μm. In some embodiments, the thickness H3of the elastic film may be within a range of 1 μm-200 μm.

The mass unit 260 may be connected to the elastic component 220, andlocated on the side of the elastic component 220 away from the sensingcavity 250. For example, the mass unit 260 may be arranged on theelastic film 221, located on the side away from the sensing cavity 250.In response to the vibration of the shell 240 and/or the energyconversion component 230, the mass unit 260 may form a resonant systemtogether with the elastic component 220 to generate vibrations. The massunit 260 has a certain mass, so that a vibration amplitude of theelastic component 220 relative to the shell 240 may be increased, sothat the volume change of the sensing cavity 250 can be significantlychanged under the action of external vibrations of differentintensities, so as to improve the sensitivity of the sensing device 210.

In some embodiments, the mass unit 260 may have a regular structure suchas a cylinder, a cube, a cuboid, or other irregular structure. As shownin FIG. 2 , the mass unit 260 may have a cylindrical structure.

In some embodiments, the mass unit 260 may be made of a material with arelatively high density. Exemplarily, the mass unit 260 may be made ofcopper, iron, stainless steel, lead, tungsten, molybdenum, and othermaterials. In some embodiments, the mass unit 260 may be made of copper.In some embodiments, the mass unit 260 may be made of some elasticmaterials. In some embodiments, the mass unit 260 made of the aboveelastic material may be disposed on the side of the elastic component220 facing toward the energy conversion component 230. For example, theat least one convex structure 223 may be provided (e.g., by cutting,injection molding, bonding, etc.) directly on the surface of the side ofthe mass unit 260 facing toward the energy conversion component 230.Since the mass unit 260 is elastic, the at least one convex structure223 provided on the mass unit 260 may also be elastic. In thisembodiment, the mass unit 260 may reduce the volume of the sensingcavity 250 and improve the sensitivity of the sensing device 210 to acertain extent. In some embodiments, the top of the at least one convexstructure 223 provided on the mass unit 260 may abut against the surfaceof the energy conversion component 230.

In some embodiments, Young's modulus of the elastic film 221 and theYoung's modulus of the mass unit 260 may have different values for thesensing device 210 of different types and/or sizes. In some embodiments,the value of Young's modulus of the elastic film 221 may be less than500 MPa. In some embodiments, the value of Young's modulus of theelastic film 221 may be less than 300 MPa. In some embodiments, thevalue of Young's modulus of the elastic film 221 may be less than 200MPa. In some embodiments, the value of Young's modulus of the elasticfilm 221 may be less than 100 MPa. In some embodiments, the value ofYoung's modulus of the elastic film 221 may be less than 80 MPa. In someembodiments, the value of Young's modulus of the elastic film 221 may beless than 60 MPa. In some embodiments, the value of Young's modulus ofthe elastic film 221 may be less than 40 MPa. In some embodiments, thevalue of Young's modulus of the mass unit 260 may be greater than 10GPa. In some embodiments, the value of Young's modulus of the mass unit260 may be greater than 50 GPa. In some embodiments, the value ofYoung's modulus of the mass unit 260 may be greater than 80 GPa. In someembodiments, the value of Young's modulus of the mass unit 260 may begreater than 100 GPa. In some embodiments, the value of Young's modulusof the mass unit 260 may be greater than 200 GPa. In some embodiments,the value of Young's modulus of the mass unit 260 may be greater than500 GPa. In some embodiments, the value of Young's modulus of the massunit 260 may be greater than 1000 GPa.

In some embodiments, the mass unit 260 may have a certain thickness. Thethickness of the mass unit refers to the size of the mass unit 260 inthe first direction. For the convenience of understanding, the thicknessof the mass unit 260 may be represented by H4 in FIG. 2 . In someembodiments, the thickness H4 of the mass unit 260 is within a range of1 μm-1000 μm. In some embodiments, the thickness H4 of the mass unit 260is within a range of 10 μm-900 μm. In some embodiments, the thickness H4of the mass unit 260 is within a range of 20 μm-800 μm. In someembodiments, the thickness H4 of the mass unit 260 is within a range of30 μm-700 μm. In some embodiments, the thickness H4 of the mass unit 260is within a range of 40 μm-600 μm. In some embodiments, the thickness H4of the mass unit 260 is within a range of 50 μm to 500 μm.

For the sensing device 210 of different types and/or sizes, a ratio ordifference between the thickness H4 of the mass unit 260 and thethickness H3 of the elastic film 221 is within a certain range. In someembodiments, the ratio of the thickness H4 of the mass unit 260 to thethickness H3 of the elastic film 221 is within a range of 1-100000. Insome embodiments, the ratio of the thickness H4 of the mass unit 260 tothe thickness H3 of the elastic film 221 is within a range of 1-50000.In some embodiments, the ratio of the thickness H4 of the mass unit 260to the thickness H3 of the elastic film 221 is within a range of10-10000. In some embodiments, the ratio of the thickness H4 of the massunit 260 to the thickness H3 of the elastic film 221 is within a rangeof 100-5000. In some embodiments, the ratio of the thickness H4 of themass unit 260 to the thickness H3 of the elastic film 221 is within arange of 100-1000. In some embodiments, the ratio of the thickness H4 ofthe mass unit 260 to the thickness H3 of the elastic film 221 is withina range of 100-5000. In some embodiments, the ratio of the thickness H4of the mass unit 260 to the thickness H3 of the elastic film 221 iswithin a range of 500-2000.

In some embodiments, the mass unit 260 may be located in the middle partof the elastic component 220 (e.g., the elastic film 221). The middlepart refers to the middle part of the elastic component 220 in a seconddirection. For example, the elastic film 221 may be circular, and themass unit 260 may have a cylindrical structure. The mass unit 260 may bearranged in the middle part of the elastic film 221. In someembodiments, the distance between the axis of the mass unit 260 and thecenter point of the elastic film 221 in the second direction may belower than a threshold distance. The threshold distance may be 50 μm.0.1 mm, 0.5 mm, 1 mm, 2 mm, etc. In some embodiments, the center pointof the elastic film 221 is on the axis of the mass unit 260. By settingthe mass unit 260 in the middle of the elastic film 221, thedisplacement of the mass unit 260 in the second direction may be reducedand the sensitivity of the sensing device 210 may be improved.

As shown in FIG. 2 , a projected area of the mass unit 260 in the firstdirection may be less than a projected area of the elastic component 220in the first direction. For the sensing device 210 of different typesand/or sizes, a ratio of the projected area of the mass unit 260 in thefirst direction to the projected area of the elastic component 220 inthe first direction may be within a certain range. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the elastic component 220 in thefirst direction may be within a range of 0.05-0.95. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the elastic component 220 in thefirst direction may be within a range of 0.1-0.9. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the elastic component 220 in thefirst direction may be within a range of 0.2-0.9. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the elastic component 220 in thefirst direction may be within a range of 0.3-0.8. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the elastic component 220 in thefirst direction may be within a range of 0.4-0.7. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the elastic component 220 in thefirst direction may be within a range of 0.5-0.6.

For the sensing device 210 of different types and/or sizes, a ratio ofthe projected area of the mass unit 260 in the first direction to aprojected area of the sensing cavity 250 in the first direction may bewithin a certain range. In some embodiments, the ratio of the projectedarea of the mass unit 260 in the first direction to the projected areaof the sensing cavity 250 in the first direction may be within a rangeof 0.05-0.95. In some embodiments, the ratio of the projected area ofthe mass unit 260 in the first direction to the projected area of thesensing cavity 250 in the first direction may be within a range of0.1-0.9. In some embodiments, the ratio of the projected area of themass unit 260 in the first direction to the projected area of thesensing cavity 250 in the first direction may be within a range of0.2-0.9. In some embodiments, the ratio of the projected area of themass unit 260 in the first direction to the projected area of thesensing cavity 250 in the first direction may be within a range of0.3-0.8. In some embodiments, the ratio of the projected area of themass unit 260 in the first direction to the projected area of thesensing cavity 250 in the first direction may be within a range of0.4-0.7. In some embodiments, the ratio of the projected area of themass unit 260 in the first direction to the projected area of thesensing cavity 250 in the first direction may be within a range of0.5-0.6.

In the present embodiment, the elastic component 220 (e.g., the elasticfilm 221) may have a higher elasticity than the shell 240, so that theelastic component 220 may move relative to the shell 240. When anexternal vibration is applied on the shell 240, the shell 240, theenergy conversion component 230, the elastic component 220, and othercomponents may vibrate. Since the vibration phase of the elasticcomponent 220 is different from the vibration phase of the energyconversion component 230, the volume of the sensing cavity 250 (i.e.,the acoustic cavity) may be changed, resulting in the change of thesound pressure of the acoustic cavity, which is converted into theelectrical signal by the energy conversion component 230 to realize thepickup of a bone conduction sound.

For better understanding, the structure composed of the elasticcomponent 220 (including the elastic film 221 and the at least oneconvex structure 223) and the mass unit 260 may be simplified andequivalent to a model of mass-spring-damping system shown in FIG. 11 ,in which the elastic component 220 provides the spring and dampingeffect for the system, and the mass unit 260 provides the mass effectfor the system. When the system works, the model of themass-spring-damping system may be forced to move under the action ofexciting force, and the vibration law of the movement conforms to thelaw of the mass-spring-damping system. Specifically, the motion of thesystem may be described by a differential equation as Equation (1):

$\begin{matrix}{{{M\frac{d^{2}x}{{dt}^{2}}} + {R\frac{dx}{dt}} + {Kx}} = {F\cos\omega t}} & (1)\end{matrix}$

where M denotes the mass of the system, R is the damping of the system,K is the elastic coefficient of the system, F is the amplitude of thedriving force, x is the displacement of the system, and ω is thecircular frequency of the driving force. By solving a steady-statedisplacement based on Equation (1):

$\begin{matrix}{x = {{x_{a}{\cos( {{\omega t} - \theta} )}{where}x_{a}} = {\frac{F}{\omega{❘Z❘}} = {\frac{F}{\omega\sqrt{R^{2} + ( {{\omega M} - {K\omega^{- 1}}} )^{2}}}.}}}} & (2)\end{matrix}$

Further, based on Equation (1) and Equation (2), a displacementamplitude ratio (normalization) equation may be obtained:

$\begin{matrix}{A = {\frac{x_{a}}{x_{a0}} = \frac{Q_{m}}{\sqrt{\frac{f^{2}}{f_{0}} + {( {\frac{f^{2}}{f_{0}} - 1} )^{2}Q_{M}^{2}}}}}} & (3)\end{matrix}$

where, f represents the frequency of the system, f₀ represents theresonance frequency of the system,

${Q_{M} = \frac{\omega_{0}M}{R}},$

Q_(M) represents the mechanical quality factor, and

$x_{a0} = \frac{F}{K}$

represents the static displacement amplitude (or the displacementamplitude at time).

When the mass unit 260 vibrates under excitation of an externalvibration signal, the volume of the sensing cavity 250 may be compressedor expanded, and the volume change of the sensing cavity 250 duringcompression or expansion is ΔV. The sensitivity S of the sensing device210 may satisfy:

${S \propto \frac{\Delta V}{V_{0}}},$

that is, the sensitivity S of the sensing device 210 may be directlyproportional to the volume change ΔV of the sensing cavity 250 andinversely proportional to the volume V₀ of the sensing cavity 250. Basedon the above principle, in some embodiments, the sensitivity of thesensing device 210 may be improved by increasing the volume change ΔV ofthe sensing cavity 250 and/or reducing the volume V₀ of the sensingcavity 250.

In some embodiments, the sensing cavity 250 may be composed of anelastic component 220, the energy conversion component 230, and othercomponents. For example, the sensing cavity 250 may be composed of theelastic component 220, an energy conversion component 230 and a sealingunit 270. In the above embodiment, the elastic component (e.g., theelastic film 221 and the at least one convex structure 223) and theenergy conversion component (e.g., the energy conversion component 230)may serve as the first sidewall and the second sidewall of the sensingcavity 250, respectively. Therefore, the structure of the elasticcomponent 220 and the energy conversion component 230 may affect thevolume of the sensing cavity 250 of the sensing device 210 and thevolume change of the sensing cavity 250 when the sensing device 210works. For the elastic component 220, since the at least one convexstructure 223 is arranged on the inner surface of the elastic film 221,and the at least one convex structure 223 may protrude into the sensingcavity 250, the volume of the sensing cavity 250 may be reduced, so thesensitivity of the sensing device 210 may be improved.

In some embodiments, the volume V₀ of the sensing cavity 250 may relateto the density of the at least one convex structure 223 forming thesensing cavity 250. It can be understood that the smaller the intervalbetween a pair of adjacent convex structures 223, the greater thedistribution density of the at least one convex structure 223 may be,and the smaller the volume V₀ of the sensing cavity 250 composed of theat least one convex structure 223 may be. The interval between a pair ofadjacent convex structures 223 refers to the distance between centers ofadjacent convex structures 223. The center may be understood as acentroid on a cross-section of the at least one convex structure 223.For the convenience of illustration, the interval between a pair ofadjacent convex structures 223 may be represented by L1 of FIG. 2 , thatis, the distance between the top or center of adjacent convexstructures. In some embodiments, the interval Ll between a pair ofadjacent convex structures 223 may be within a range of 1 μm-2000 μm. Insome embodiments, the interval L1 between a pair of adjacent convexstructures 223 may be within a range of 4 μm-1500 μm. In someembodiments, the interval L1 between a pair of adjacent convexstructures 223 may be within a range of 8 μm-1000 μm. In someembodiments, the interval L1 between a pair of adjacent convexstructures 223 may be within a range of 10 μm-500 μm.

In some embodiments, the volume V₀ of the sensing cavity 250 may relateto a width of the at least one convex structure 223. The width of the atleast one convex structure 223 may be understood as a size of the atleast one convex structure 223 in the second direction. For theconvenience of illustration, the size of one convex structure 223 in thesecond direction may be represented by L2 in FIG. 2 . In someembodiments, the width L2 of a single convex structure 223 may be withina range of 1 μm-1000 μm. In some embodiments, the width L2 of a singleconvex structure 223 may be within a range of 2 μm-800 μm. In someembodiments, the width L2 of a single convex structure 223 may be withina range of 3 μm-600 μm. In some embodiments, the width L2 of a singleconvex structure 223 may be within a range of 6 μm-400 μm. In someembodiments, the width L2 of a single convex structure 223 may be withina range of 10 μm-300 μm.

For the sensing device 210 of different types and/or sizes, a ratio ofthe width L2 of the at least one convex structure 223 to the interval Llbetween a pair of adjacent convex structures 223 may be within a certainrange. In some embodiments, the ratio of the width L2 of the at leastone convex structure 223 to the interval L1 between a pair of adjacentconvex structures 223 may be within a range of 0.05-20. In someembodiments, the ratio of the width L2 of the at least one convexstructure 223 to the interval Ll between a pair of adjacent convexstructures 223 may be within a range of 0.1-20. In some embodiments, theratio of the width L2 of the at least one convex structure 223 to theinterval L1 between a pair of adjacent convex structures 223 may bewithin a range of 0.1-10. In some embodiments, the ratio of the width L2of the at least one convex structure 223 to the interval L1 between apair of adjacent convex structures 223 may be within a range of 0.5-8.In some embodiments, the ratio of the width L2 of the at least oneconvex structure 223 to the interval Ll between a pair of adjacentconvex structures 223 may be within a range of 1-6. In some embodiments,the ratio of the width L2 of the at least one convex structure 223 tothe interval L1 between a pair of adjacent convex structures 223 may bewithin a range of 2-4.

In some embodiments, the volume V₀ of the sensing cavity 250 may relateto a height H1 of the at least one convex structure 223. The height ofthe at least one convex structure 223 may be understood as a size in thefirst direction when the at least one convex structure 223 is in anatural state (for example, when the at least one convex structure 223is not squeezed to generate elastic deformation). For the convenience ofillustration, the size of the at least one convex structure 223 in thefirst direction may be represented by H1 in FIG. 2 . In someembodiments, the height H1 of the at least one convex structure 223 maybe within a range of 1 μm-1000 μm. In some embodiments, the height H1 ofthe at least one convex structure 223 may be within a range of 2 μm-800μm. In some embodiments, the height H1 of the at least one convexstructure 223 may be within a range of 4 μm-600 μm. In some embodiments,the height H1 of the at least one convex structure 223 may be within arange of 6 μm-500 μm. In some embodiments, the height H1 of the at leastone convex structure 223 may be within a range of 8 μm-400 μm. In someembodiments, the height H1 of the at least one convex structure 223 maybe within a range of 10 μm-300 μm.

In some embodiments, a difference between the height of the sensingcavity 250 and the height of the at least one convex structure 223 maybe within a certain range. For example, at least part of the at leastone convex structure 223 may not be in contact with the energyconversion component 230. At this time, a certain gap may exist betweenthe at least one convex structure 223 and the surface of the energyconversion component 230. The gap between the at least one convexstructure 223 and the surface of the energy conversion component 230refers to the distance between the top of the at least one convexstructure 223 and the surface of the energy conversion component 230.The gap may be formed by the process of fabricating the at least oneconvex structure 223 or installing the elastic component 220. The heightof the sensing cavity 250 may be understood as the size of the sensingcavity 250 in the first direction in a natural state (for example, whenthe first sidewall and the second sidewall do not vibrate or elasticallydeform). For ease of illustration, the size of the sensing cavity 250 inthe first direction may be represented by H2 in FIG. 2 . In someembodiments, a difference between the height H1 of the at least oneconvex structure 223 and the height H2 of the sensing cavity 250 may bewithin 20%. In some embodiments, a difference between the height H1 ofthe at least one convex structure 223 and the height H2 of the sensingcavity 250 may be within 15%. In some embodiments, a difference betweenthe height H1 of the at least one convex structure 223 and the height H2of the sensing cavity 250 may be within 10%. In some embodiments, adifference between the height H1 of the at least one convex structure223 and the height H2 of the sensing cavity 250 may be within 5%. Insome embodiments, a gap between the at least one convex structure 223and the surface of the energy conversion component 230 may be within 10μm. In some embodiments, a gap between the at least one convex structure223 and the surface of the energy conversion component 230 may be within5 μm. In some embodiments, a gap between the at least one convexstructure 223 and the surface of the energy conversion component 230 maybe within 1 μm.

During the operation of the sensing device 210, the elastic component220 may generate vibration or elastic deformation after receiving anexternal signal (e.g., a vibration signal), and may drive the at leastone convex structure 223 to move in the first direction shown in FIG. 2, so that the sensing cavity 250 may shrink or expand, and the volumechange of the sensing cavity 250 may be expressed as ΔV1. Since a motionamplitude of the elastic component 220 and the at least one convexstructure 223 in the first direction is small, for example, the motionamplitude of the at least one convex structure 223 in the firstdirection may be usually less than 1 μm, in the process, the at leastone convex structure 223 may not be in contact with the surface of theenergy conversion component 230, so ΔV1 may have nothing to do with theat least one convex structure 223, and the value of ΔV1 may be small.

For the sensing device 210 of different types and/or sizes, a ratio ordifference between the height H1 of the at least one convex structure223 and the thickness H3 of the elastic film 221 may be within a certainrange. In some embodiments, the ratio of the height H1 of the at leastone convex structure 223 to the thickness H3 of the elastic film 221 maybe within a range of 0.5-500. In some embodiments, the ratio of theheight H1 of the at least one convex structure 223 to the thickness H3of the elastic film 221 may be within a range of 1-500. In someembodiments, the ratio of the height H1 of the at least one convexstructure 223 to the thickness H3 of the elastic film 221 may be withina range of 1-200. In some embodiments, the ratio of the height H1 of theat least one convex structure 223 to the thickness H3 of the elasticfilm 221 may be within a range of 1-100. In some embodiments, the ratioof the height H1 of the at least one convex structure 223 to thethickness H3 of the elastic film 221 may be within a range of 10-90. Insome embodiments, the ratio of the height H1 of the at least one convexstructure 223 to the thickness H3 of the elastic film 221 may be withina range of 20-80. In some embodiments, the ratio of the height H1 of theat least one convex structure 223 to the thickness H3 of the elasticfilm 221 may be within a range of 40-60.

In some embodiments, the at least one convex structure 223 may bedirectly contacted with the surface of the energy conversion component230. At this time, the height H1 of the at least one convex structure223 is the same as or similar to the height H2 of the sensing cavity250. FIG. 3A is a schematic diagram illustrating an exemplary section ofthe at least one convex structure abutting against the second sidewallof the sensing cavity according to some embodiments of the presentdisclosure; FIG. 3B is another schematic diagram illustrating anexemplary section of the at least one convex structure abutting againstthe second sidewall of the sensing cavity according to some embodimentsof the present disclosure; As shown in FIG. 3 A, the at least one convexstructure 223 may abut against the second sidewall of the sensing cavity250. The at least one convex structure 223 may have certain elasticity.In this embodiment, when the elastic component 220 is motivated byexternal forces and moves, the elastic component 220 may drive the atleast one convex structure 223 to move in the direction of the energyconversion component 230. The elastic component 220 and the at least oneconvex structure 223 may reduce the volume of the sensing cavity 250,and the volume of the sensing cavity 250 may be expressed as a variablevolume ΔV1. In addition, because the at least one convex structure 223may abut against the energy conversion component 230, the at least oneconvex structure 223 may be squeezed by the energy conversion component230 under the action of external forces. Because the at least one convexstructure 223 may have certain elasticity, the force generated by thesqueezing may cause the flexible deformation of the at least one convexstructure 223. The at least one convex structure 223 may further reducethe volume of the sensing cavity 250 when the elastic deformationoccurs. FIG. 3B shows the amplitude of the movement of the at least oneconvex structure 223 in the first direction and the elastic deformationgenerated. The solid line P1 shows the outline and position of the atleast one convex structure 223 after squeezing. The dotted line P2 showsthe outline and position of the at least one convex structure 223 beforesqueezing. It can be seen from the figure that due to the elasticdeformation of the at least one convex structure 223, the volume of thesensing cavity 250 may be further reduced. For the convenience ofdescription, a value of the volume change of the sensing cavity 250caused by the second sidewall of the sensing cavity 250 squeezing the atleast one convex structure 223 may be represented as ΔV2. Based on theabove content, if the at least one convex structure 223 abuts againstthe second sidewall of the sensing cavity 250, the volume change ΔV ofthe sensing cavity 250 may be the sum of ΔV1 and ΔV2 during theoperation of the sensing device 210. Therefore, the volume change ΔV ofthe sensing cavity 250 may be greater than ΔV1, which may furtherimprove the sensitivity of the sensing device 210. In addition, due tothe deformation of the at least one convex structure 223, compared withthe natural state, the size of the at least one convex structure 223 inthe first direction becomes smaller, so the height H2 of the sensingcavity 250 may be smaller than the size of the at least one convexstructure 223 in the natural state (i.e., H1).

In some embodiments, the volume change ΔV2 of the sensing cavity 250 mayrelate to materials of the at least one convex structure 223. The atleast one convex structure 223 may be made of materials with certaincharacteristics. For example, the at least one convex structure 223 mayhave a specific value of Young's modulus. In some embodiments, the valueof Young's modulus of the at least one convex structure 223 is 10 kpa-10mpa. In some embodiments, the value of Young's modulus of the at leastone convex structure 223 is 20 KPa-8 MPa. In some embodiments, the valueof Young's modulus of the at least one convex structure 223 is 50 kPa-5MPa. In some embodiments, the value of Young's modulus of the at leastone convex structure 223 is 80 kPa-2 MPa. In some embodiments, the valueof Young's modulus of the at least one convex structure 223 is 100 kPa-1MPa. For the sensing device 210 of different types and/or sizes, theratio or difference between the Young's modulus of the at least oneconvex structure 223 and the Young's modulus of the elastic film 221 maybe within a certain range. In some embodiments, the ratio of the Young'smodulus of the at least one convex structure 223 to the Young's modulusof the elastic film 221 may be within a range of 0.005-1. In someembodiments, the ratio of the Young's modulus of the at least one convexstructure 223 to the Young's modulus of the elastic film 221 may bewithin a range of 0.01-1. In some embodiments, the ratio of the Young'smodulus of the at least one convex structure 223 to the Young's modulusof the elastic film 221 may be within a range of 0.05-0.8. In someembodiments, the ratio of the Young's modulus of the at least one convexstructure 223 to the Young's modulus of the elastic film 221 may bewithin a range of 0.1-0.6. In some embodiments, the ratio of the Young'smodulus of the at least one convex structure 223 to the Young's modulusof the elastic film 221 may be within a range of 0.2-0.4.

In some embodiments, the materials for making the at least one convexstructure 223 may include one or more of silica gels, silicone gels,silicone rubbers, PDMS, and styrene butadiene styrene block copolymers(SBS), so as to ensure that the at least one convex structure 223 mayhave high elasticity and greater elastic deformation when subjected tothe same external force, so the volume change ΔV2 of the sensing cavity250 may be greater.

In some embodiments, the volume change ΔV2 of the sensing cavity 250 mayalso relate to shapes of the at least one convex structure 223. In someembodiments, the shapes of the at least one convex structure 223 may bevarious shapes. FIGS. 4 to 6 shows three different shapes of at leastone convex structure respectively. The at least one convex structure 423in FIG. 4 has the shape of a pyramid, which is distributed on the innersurface of an elastic component 420 in the form of a dot array. Theshape of the at least one convex structure 523 in FIG. 5 is ahemispherical shape, which is distributed on the inner surface of anelastic component 520 in the form of a dot array. The shape of the atleast one convex structure 623 in FIG. 6 is a stripe shape, which isdistributed on the inner surface of an elastic component 620 in the formof a line array. It is understood that this is only for the purpose ofthe explanation, and it does not aim to limit the shape of the at leastone convex structure 223. The convex structure 223 may also have otherpossible shapes. For example, a ladder shaped, a cylindrical, anellipsoidal, etc.

With reference to FIG. 4 , the shape of the at least one convexstructure 223 is pyramid—shaped, compared with other shapes (forexample, hemispherical), when the at least one convex structure 223 isaffected by external forces, the pyramid-shaped convex structure 223 maycause stress concentration at the top. For the different shapes of atleast one convex structure 223, if their Yang's modulus is the same, theequivalent stiffness of the pyramid-shaped convex structure 223 may belower, the elasticity factor may be lower, and the elastic deformationmay be greater, which may make the volume change ΔV2 of the sensingcavity 50 greater, and the sensitivity amplification of sensing device210 greater.

In some embodiments, the sensitivity of the sensing device 210 relatesto the resonance frequency ω₀ (i.e., the f₀ of the Equation (3)) of thesystem composed of the mass unit 260 and the elastic component 220.Specifically,

${\omega_{0} \propto \sqrt{\frac{K}{M}}},$

when the

$\frac{K}{M}$

is reduced, the sound pressure variation Δp of the sensing cavity 250 ofthe sensing device 210 may become larger, and the system's resonancefrequency may be reduced. The resonance frequency ω₀ may affect thesensitivity of the sensing device 210 within a certain frequency rangebefore and after the resonance frequency. Therefore, in the process ofadjusting the sensitivity of the sensing device 210 by adjusting theresonance frequency of the sensing device 210, the influence of afrequency range on the sensitivity of the sensing device 210 may need tobe considered. In some embodiments, the resonance frequency of thesensing device 210 may be within a range of 1500 Hz to 6000 Hz. In someembodiments, the resonance frequency of the sensing device 210 may bewithin a range of 1500 Hz-5000 Hz. In some embodiments, the resonancefrequency of the sensing device 210 may be within a range of 1500Hz-4000 Hz. In some embodiments, the resonance frequency of the sensingdevice 210 may be within a range of 1500 Hz-3000 Hz.

FIG. 7 is a schematic diagram illustrating an exemplary sensing deviceaccording to some other embodiments of the present disclosure. Similarto the sensing device 210, the sensing device 710 may include an energyconversion component 230, a shell 240, a sensing cavity 250, a mass unit260, a sealing unit 270, and an elastic component 720. The shell 240 maycover the energy conversion component 230 to form the accommodationspace 241. The elastic component 720, the mass unit 260, and the sealingunit 270 may be accommodated in the accommodation space 241. An outeredge of the elastic component 720 may be fixedly connected with theenergy conversion component 230 through the sealing unit 270. Theelastic component 720, the energy conversion component 230 and thesealing unit 270 may together form the sensing cavity 250. The mass unit260 may be arranged on a side of the elastic component 720 away from thesensing cavity 250 to increase a vibration amplitude of the elasticcomponent 720.

In some embodiments, the sensing device 710 shown in FIG. 7 may beapplied to the field of microphones as a vibration sensing device, suchas a bone conduction microphone. For example, when applied to a boneconduction microphone, the sensing cavity 250 may also be referred to asan acoustic cavity, and the energy conversion component 230 may be anacoustic transducer. The acoustic transducer may obtain a sound pressurechange of the acoustic cavity and convert the sound pressure change ofthe acoustic cavity into an electrical signal.

Unlike the sensing device 210 shown in FIG. 2 , in the sensing device710 shown in FIG. 7 , the elastic component 720 may include an elasticfilm 721 and an elastic microstructure layer 725. One side of theelastic microstructure layer 725 may be connected with the elastic film721, and the surface of another side may be provided with the at leastone convex structure 223. For example, the at least one convex structure223 may be fabricated in two ways. Method (1) is to etch a groove on asilicon wafer, and a shape of the groove may correspond to the shape ofthe at least one convex structure 223 to be made. Then, the material(e.g., PDMS) for making the at least one convex structure 223 may becoated on the silicon wafer. The PDMS may fill the groove of the siliconwafer and form a PDMS film on a surface of the silicon wafer. Then,before the PDMS in the groove and the PDMS film on the surface of thesilicon wafer are cured, the material for making the elastic film 721,such as PI, may be coated on the surface of the PDMS film. Finally, thePDMS film, the elastic film 721 and the at least one convex structure223 may be taken out after curing. Method (2) is also etching a grooveon the silicon wafer. Then, the material (e.g., PDMS) for making the atleast one convex structure 223 may be coated on the silicon wafer. Afterthe PDMS in the groove and the PDMS film on the surface of the siliconwafer are cured, the material (e.g., PI) for making the elastic film 721may be coated on the surface of the PDMS film or glue may be addedbefore coating. Finally, wait for the elastic film 721 to cure and takeit out. The at least one convex structure 223 and the elastic film 721fabricated by above two methods may contain a layer of PDMS film, whichmay be the elastic microstructure layer 725.

In some embodiments, the elastic microstructure layer 725 may be made ofthe same material as the elastic film 721. For example, both the elasticmicrostructure layer 725 and the elastic film 721 may be made of PDMS.Specifically, when fabricating the at least one convex structure 223, aPDMS film may be coated on the surface of the PDMS film (i.e., theelastic microstructure layer 725) as the elastic film 721. In someembodiments, the elastic microstructure layer 725 may be made of thedifferent material from the elastic film 721. For example, the elasticmicrostructure layer 725 may be made of PDMS, while the elastic film 721may be made of PI. As another example, the elastic microstructure layer725 may be made of PDMS, and the elastic film 721 may be made of PTFE.

In some embodiments, a thickness of the elastic film 721 may be the sameas or different from the thickness of the elastic film 221 in theforegoing embodiment. The thickness of the elastic microstructure layer725 refers to a size of the elastic microstructure layer 725 in thefirst direction, which may be represented by H5 in FIG. 7 . In someembodiments, the thickness H5 of the elastic microstructure layer 725may be within a range of 1 μm-1000 μm. In some embodiments, thethickness H5 of the elastic microstructure layer 725 may be within arange of 10 μm-200 μm. In some embodiments, the thickness H5 of theelastic microstructure layer 725 may be within a range of 20 μm-100 μm.

In some embodiments, comparing the sensing device 210 of different typesand/or sizes, a ratio of the thickness H5 of the elastic microstructurelayer 725 to the thickness of the elastic component 720 (i.e., a sum ofH5 and H3) may be within a range of 0.5-1. In some embodiments, theratio of the thickness H5 of the elastic microstructure layer 725 to thethickness of the elastic component 720 may be within a range of 0.8-1.In some embodiments, the ratio of the thickness H5 of the elasticmicrostructure layer 725 to the thickness of the elastic component 720may be within a range of 0.9-1.

FIG. 8 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure. As shown inFIG. 8 , the sensing device 810 may include the energy conversioncomponent 230, the shell 240, the sensing cavity 250, the mass unit 260,and an elastic component 820. In some embodiments, except for thedifferent sealing methods of the sensing cavity 250, the sensing device810 shown in FIG. 8 may be similar to the sensing device 710 shown inFIG. 7 . An outer edge of the elastic component 820 of the sensingdevice 810 may be directly and fixedly connected with the shell 240, andthen the sensing cavity 250 may be formed by the energy conversioncomponent 230, the shell 240 and the elastic component 820. In someembodiments, the elastic component 820 may include an elastic film 821and an elastic microstructure layer 825. The at least one convexstructure 223 may be part of the elastic microstructure layer 825. Theelastic microstructure layer 825 may be connected with the elastic film821 on a side away from the sensing cavity 250. One side of the elasticmicrostructure layer 825 close to the sensing cavity 250 may be arrangedon the at least one convex structure 223. The elastic film 821 and/orthe elastic microstructure layer 825 may be directly connected with theshell 240, and the connection method may include a bonding connection, aclamping connection, a riveting connection, and a nailing connection,etc. For example, as shown in FIG. 8 , an edge of the elastic film 821may be directly embedded in a sidewall of the shell 240, the elasticmicrostructure layer 825 may be close to an inner wall of the shell 240to ensure the sealing performance of the sensing cavity 250. In theembodiment, the elastic component 820 may be directly connected with theshell 240. On the one hand, a connection of the elastic component 820with the shell 240 can ensure that the sensing cavity 250 has goodsealing performance. On the other hand, the connection of the elasticcomponent 820 with the shell 240 can eliminate the sealing unit,simplify a structure of the sensing device 810, and simplify amanufacturing process of the sensing device 810.

In some embodiments, when the elastic component 820 is directlyconnected to the shell 240, the projected area of the mass unit 260 inthe first direction is less than the projected area of the sensingcavity 250 in the first direction. Specifically, if the elasticcomponent 820 (for example, the elastic film 821 and the elasticmicrostructure layer 825 of the elastic component 820) are directly andfixedly connected with the shell 240, the projection area of the sensingcavity 250 in the first direction may need to be greater than theprojection area of the mass unit 260 in the first direction, so that anedge of the mass unit 260 may have a certain gap with the shell 240, andthe mass unit 260 may vibrate in the first direction. In someembodiments, the ratio of the projected area of the mass unit 260 in thefirst direction to the projected area of the sensing cavity 250 in thefirst direction may be within a range of 0.05-0.95. In some embodiments,the ratio of the projected area of the mass unit 260 in the firstdirection to the projected area of the sensing cavity 250 in the firstdirection may be within a range of 0.1-0.9. In some embodiments, theratio of the projected area of the mass unit 260 in the first directionto the projected area of the sensing cavity 250 in the first directionmay be within a range of 0.2-0.9. In some embodiments, the ratio of theprojected area of the mass unit 260 in the first direction to theprojected area of the sensing cavity 250 in the first direction may bewithin a range of 0.3-0.8. In some embodiments, the ratio of theprojected area of the mass unit 260 in the first direction to theprojected area of the sensing cavity 250 in the first direction may bewithin a range of 0.4-0.7. In some embodiments, the ratio of theprojected area of the mass unit 260 in the first direction to theprojected area of the sensing cavity 250 in the first direction may bewithin a range of 0.5-0.6.

FIG. 9 is a schematic diagram illustrating an exemplary sensing deviceaccording to some embodiments of the present disclosure. A sensingdevice 910 shown in FIG. 9 is similar to the sensing device 210 shown inFIG. 2 , except that an elastic component 920 of the sensing device 910may include a first elastic component 920-1 and a second elasticcomponent 920-2. The first elastic component 920-1 and the secondelastic component 920-2 may be respectively disposed on both sides ofthe mass unit 260 in the first direction, respectively. The firstelastic component 920-1 may be located on the side of the mass unit 260close to the energy conversion component 230, and the second elasticcomponent 920-2 may be located on the side of the mass unit 260 awayfrom the energy conversion component 230. Similar to the elasticcomponent 220 shown in FIG. 2 , the first elastic component 920-1 mayinclude a first elastic film 221-1 and at least one first convexstructure 223-1 arranged on the surface (also known as the innersurface) of the first elastic film 221-1 facing toward the sensingcavity 250. The edge of the at least one first convex structure 223-1may be hermetically connected with the energy conversion component 230through a first sealing unit 270-1, so that the first elastic film221-1, the at least one first convex structure 223-1, the first sealingunit 270-1 and the energy conversion component 230 may jointly form thesensing cavity 250. The second elastic component 920-2 may include asecond elastic film 221-2 and at least one convex second structure 223-2arranged on the side of the second elastic film 221-2 away from thesensing cavity 250. The edge of the at least one convex second structure223-2 may be hermetically connected with a top wall (i.e., the side ofthe shell 240 away from the energy conversion component 230) of theshell 240 through second sealing unit 270-2.

In some embodiments, at least one of the first elastic component 920-1and the second elastic component 920-2 may include an elasticmicrostructure layer (not shown in the figure). Taking the first elasticcomponent 920-1 as an example, the first elastic component 920-1 mayinclude the first elastic film 221-1 and a first elastic microstructurelayer, which may be arranged on the side of the first elastic film 221-1facing toward the energy conversion component 230. The side of the firstelastic microstructure layer facing toward the energy conversioncomponent 230 may include at least one first convex structure 223-1. Theat least one first convex structure 223-1 may be part of the firstelastic microstructure layer. The elastic microstructure layer may bethe same as or similar to the elastic microstructure layer (e.g., theelastic microstructure layer 725 shown in FIG. 7 ) in one or more of theforegoing embodiments, which will not be repeated here.

As shown in FIG. 9 , the first elastic component 920-1 and the secondelastic component 920-2 are distributed on opposite sides of the massunit 260 in the first direction. The first elastic component 920-1 andthe second elastic component 920-2 may be approximately regarded as anelastic component 920. For the convenience of description, the elasticcomponent 920 formed by the first elastic component 920-1 and the secondelastic component 920-2 as a whole may be referred to as the thirdelastic component. A centroid of the third elastic component maycoincide or approximately coincide with the center of gravity of themass unit 260, and the second elastic component 920-2 may behermetically connected with the top wall (i.e., the side of the shell240 away from the energy conversion component 230) of the shell 240, sothat within a target frequency range (e.g., below 3000 Hz), a responsesensitivity of the third elastic component to the vibration of the shell240 in the first direction may be higher than a response sensitivity ofthe third elastic component to the vibration of the shell 240 in thesecond direction.

In some embodiments, the third elastic component (i.e., the elasticcomponent 920) may generate vibration in the first direction in responseto the vibration of the shell 240. The vibration in the first directionmay be regarded as a target signal picked up by the sensing device 910(e.g., the vibration sensing device), and the vibration in the seconddirection may be regarded as a noise signal. During the operation of thesensing device 910, the response sensitivity of the third elasticcomponent to the vibration of the shell 240 in the second direction maybe reduced by reducing the vibration generated by the third elasticcomponent in the second direction, so as to improve the directionselectivity of the sensing device 910 and reduce the interference of thenoise signal to a sound signal.

In some embodiments, when the third elastic component vibrates inresponse to the vibration of the shell 240, if the centroid of the thirdelastic component coincides or approximately coincides with the centerof gravity of the mass unit 260, and the second elastic component 920-2is hermetically connected with the top wall (i.e., the side of the shell240 away from the energy conversion component 230) of the shell 240, itmay be realized on the premise that the response sensitivity of thethird elastic component to the vibration of the shell 240 in the firstdirection is basically unchanged, the vibration of the mass unit 260 inthe second direction may be reduced, so as to reduce the responsesensitivity of the third elastic component to the vibration of the shell240 in the second direction, and then improve the direction selectivityof the sensing device 910. It should be noted that the centroid of thethird elastic component approximately coincides with the center ofgravity of the mass unit 260, which may be understood as that the thirdelastic component is a regular geometric structure with uniform density,so the centroid of the third elastic component approximately coincideswith its center of gravity. The center of gravity of the third elasticcomponent may be regarded as the center of gravity of the mass unit 260.At this time, the centroid of the third elastic component may beregarded as approximately coincides with the center of gravity of themass unit 260. In some embodiments, when the third elastic component isan irregular structure or the density is uneven, it may be regarded asthat the actual center of gravity of the third elastic componentapproximately coincides with the center of gravity of the mass unit 260.Approximate coincidence may mean that the distance between the actualcenter of gravity of the third elastic component or the centroid of thethird elastic component and the center of gravity of the mass unit 260is within a certain range, for example, less than 100 μm, less than 500μm, less than 1 mm, less than 2 mm, less than 3 mm, less than 5 mm, lessthan 10 mm, etc.

When the centroid of the third elastic component coincides orapproximately coincides with the center of gravity of the mass unit 260,the resonance frequency of the third elastic component vibrating in thesecond direction may be shifted to high frequency without changing theresonance frequency of the third elastic component vibrating in thefirst direction. The resonance frequency of the third elastic componentvibrating in the first direction may basically remain unchanged, forexample, the resonance frequency of the third elastic componentvibrating in the first direction may be a frequency within a frequencyrange (e.g., 20 Hz-2000 Hz, 2000 Hz-3000 Hz, etc.) that can be easilyperceived by the human ear. The resonance frequency of the third elasticcomponent vibrating in the second direction may be shifted to a highfrequency and located in a frequency range (for example, 5000 Hz-9000Hz, 1 kHz-14 kHz, etc.) in which the human ear perception is relativelyweak.

FIG. 10 is a schematic diagram illustrating an exemplary connectionbetween a sensing element and a shell according to some embodiments ofthe present disclosure. The sensing element 1010 may be an independentcomponent. The sensing element 1010 may form a high-sensitivity sensingdevice (e.g., the sensing device 10, the sensing device 210) byassembling with (e.g., by gluing or bonding, or by other detachablemeans) a specific type of energy conversion component (not shown in thefigure). The specific type of energy conversion component may generate arequired signal e.g., an electrical signal) in response to a change inthe volume of the first sensing cavity 1050. The specific type of energyconversion component may include, for example, an acoustic energyconversion component, such as an air conduction microphone.

As shown in FIG. 10 , the sensing element 1010 may include the shell240, the mass unit 260, a first sensing cavity 1050, and the elasticcomponent 820. The elastic component 820, the mass unit 260, and theshell 240 shown in FIG. 10 may be the same or similar to thecorresponding components or units of the sensing device 810 shown inFIG. 8 , which will not be repeated here. The elastic component 820 maybe used as the first sidewall of the first sensing cavity 1050 to formthe first sensing cavity 1050 together with the shell 240. The firstsensing cavity 1050 may be a semi-closed structure. In addition, thefirst sensing cavity 1050 of the sensing element 1010 may be not closed,so dust and impurities may enter the first sensing cavity 1050 duringtransportation and installation, affecting the performance of thesensing element 1010. Therefore, in some embodiments, a dust-proofstructure may be provided at an opening of the unclosed sensing element1010, that is, the opening side of the first sensing cavity 1050. Anexemplary dust-proof structure may include a dust-proof film, adust-proof cover, or the like.

As an independent component, the sensing element 1010 may be connectedwith the specific type of energy conversion component to form a sensingdevice (e.g., the sensing device 10, the sensing device 210). Forexample, the sensing element 1010 may be fitted with an energyconversion component (e.g., including an acoustic transducer), and theenergy conversion component may be placed relative to the elasticcomponent 820 to form a closed sensing cavity. The energy conversioncomponent may convert the volume change of the closed sensing cavityinto the electrical signal. In some embodiments, the energy conversioncomponent may be connected to a connecting board 1031. For example, theenergy conversion component may be connected on the side of theconnecting board 1031 away from the sensing element 1010. The connectingboard 1031 may be a printed circuit board (PCB), for example, a phenolicPCB paper substrate, a composite PCB substrate, a glass fiber PCBsubstrate, a metal PCB substrate, a build-up multilayer PCB substrate,etc. In some embodiments, the connecting board 1031 may be an FR-4 gradeglass fiber PCB substrate made of epoxy glass fiber cloth. In someembodiments, the connecting board 1031 may also be a flexible printedcircuit board (FPC). The connecting board 1031 may be provided (forexample, by means of laser etching, chemical etching, embedding, etc.)with circuits and other components, such as processors, memories, etc.In some embodiments, the energy conversion component may be fixedlyconnected to the connecting board 1031 through a fixing glue or a metallead frame. In some embodiments, the fixing glue may be a conductiveadhesive (e.g., a silver conductive adhesive, a cupric powder conductiveadhesive, a nickel carbon conductive adhesive, a silver-copperconductive adhesive, etc.). The conductive adhesive may be a conductiveglue, a conductive adhesive film, a conductive rubber ring, a conductiveadhesive tape, etc. The connecting board 1031 may include at least oneopening 1033. An element (e.g., the diaphragm of the air conductionmicrophone) for obtaining a sensing signal in the energy conversioncomponent may be connected with the first sensing cavity 1050 throughthe opening 1033.

By connecting the shell 240 of the sensing element 1010 to theconnecting board 1031, the sensing element 1010, the connecting board1031, and the energy conversion component connected to the connectingboard 1031 may form a sensing device. A connection method between theshell 240 and the connecting board 1031 may include a bondingconnection, a clamping connection, a welding connection, a rivetingconnection, a nailing connection, etc. At this time, the elasticcomponent 820, the shell 240, the connecting board 1031, and the elementof the energy conversion component for obtaining the sensing signal mayjointly form a closed sensing cavity (such as the sensing cavity 250).The first sensing cavity 1050 may be a part (e.g., a sub-cavity) of theclosed sensing cavity. The connecting board 1031 and the element forobtaining the sensing signal of the energy conversion component may formsecond sidewall of the closed sensing cavity.

The first sidewall formed by the elastic component 820 may be providedwith at least one convex structure 823. The at least one convexstructure 823 may reduce the volume of the sensing cavity or part of thefirst sensing cavity 1050 to increase the sensitivity of the sensingdevice. In some embodiments, when the sensing element 1010 forms asensing device with the energy conversion component, the at least oneconvex structure may be configured to abut against the second sidewallof the sensing cavity. When the sensing device 1010 is in the workingstate, the elastic component 820 may drive the at least one convexstructure 223 to vibrate and be squeezed by the second sidewall of thesensing cavity, resulting in elastic deformation. When the at least oneconvex structure is elastically deformed, the volume change of thesensing cavity may be improved, so as to improve the sensitivity of thesensing device 1010. In addition, the existence of the at least oneconvex structure may effectively reduce the contact area between theelastic component 820 and the second sidewall of the sensing cavity,prevent adhesion with the second sidewall forming the sensing cavity andimprove the stability and reliability of the sensing device 1010.

It should be noted that the connecting board 1031 may also be a part ofthe sensing element 1010, the specific type of energy conversioncomponent may form a sensing device together with the sensing element1010 by connecting to the connecting board 1031. At this time, theelastic component, the shell 240, and the connecting board 1031 may formcomponent of the first sensing cavity 1050.

The above description of the structure of the sensing element 1010 isonly a specific example and should not be regarded as the only feasibleembodiment. Obviously, for those skilled in the art, after understandingthe basic principle of bone conduction loudspeaker, variousmodifications and changes in form and detail may be made to the specificmethods and steps of implementing the sensing element 1010 withoutdeparting from this principle, but these modifications and changes arestill within the scope described above. For example, the sensing element1010 may not include a mass unit 260. For another example, when thesensing element 1010 is connected with the connecting board 1031 of theacoustic transducer, the at least one convex structure 223 may not abutagainst the second sidewall formed by the connecting board 1031.

The basic concepts have been described above. Obviously, to thoseskilled in the art, the disclosure of the invention is merely by way ofexample, and does not constitute a limitation on the present disclosure.Although not explicitly stated here, those skilled in the art may makevarious modifications, improvements and amendments to the presentdisclosure. These alterations, improvements, and modifications areintended to be suggested by this disclosure, and are within the spiritand scope of the exemplary embodiments of this disclosure.

Moreover, certain terminology has been used to describe embodiments ofthe present disclosure. For example, the terms “one embodiment,” “anembodiment,” and/or “some embodiments” mean that a particular feature,structure or characteristic described in connection with the embodimentis included in at least one embodiment of the present disclosure.Therefore, it is emphasized and should be appreciated that two or morereferences to “an embodiment” or “one embodiment” or “an alternativeembodiment” in various parts of this specification are not necessarilyall referring to the same embodiment. In addition, some features,structures, or features in the present disclosure of one or moreembodiments may be appropriately combined.

In addition, those skilled in the art may understand that variousaspects of the present disclosure may be illustrated and describedthrough several patentable categories or situations, including any newand useful processes, machines, products or combinations of materials orany new and useful improvements to them. Correspondingly, all aspects ofthe present disclosure can be completely executed by hardware, software(including firmware, resident software, microcode, etc.), or acombination of hardware and software. The above hardware or software canbe referred to as “data block”, “module”, “engine”, “unit”, “component”or “system”. In addition, aspects of the present disclosure may appearas a computer product located in one or more computer-readable media,the product including computer-readable program code.

Furthermore, the recited order of processing elements or sequences, orthe use of numbers, letters, or other designations therefore, is notintended to limit the claimed processes and methods to any order exceptas may be specified in the claims. Although the above disclosurediscusses through various examples what is currently considered to be avariety of useful embodiments of the disclosure, it is to be understoodthat such detail is solely for that purpose, and that the appendedclaims are not limited to the disclosed embodiments, but, on thecontrary, are intended to cover modifications and equivalentarrangements that are within the spirit and scope of the disclosedembodiments. For example, although the implementation of variouscomponents described above may be embodied in a hardware device, it mayalso be implemented as a software only solution, e.g., an installationon an existing server or mobile device.

Similarly, it should be appreciated that in the foregoing description ofembodiments of the present disclosure, various features are sometimesgrouped together in a single embodiment, figure, or description thereoffor the purpose of streamlining the disclosure aiding in theunderstanding of one or more of the various embodiments. However, thisdisclosure does not mean that the present disclosure object requiresmore features than the features mentioned in the claims. Rather, claimedsubject matter may lie in less than all features of a single foregoingdisclosed embodiment.

In some embodiments, the numbers expressing quantities of ingredients,properties, and so forth, used to describe and claim certain embodimentsof the application are to be understood as being modified in someinstances by the term “about,” “approximate,” or “substantially”. Unlessotherwise stated, “about,” “approximate,” or “substantially” mayindicate ±20% variation of the value it describes. Accordingly, in someembodiments, the numerical parameters set forth in the description andattached claims are approximations that may vary depending upon thedesired properties sought to be obtained by a particular embodiment. Insome embodiments, numerical data should take into account the specifiedsignificant digits and use an algorithm reserved for general digits.Notwithstanding that the numerical ranges and parameters configured toillustrate the broad scope of some embodiments of the present disclosureare approximations, the numerical values in specific examples may be asaccurate as possible within a practical scope.

At last, it should be understood that the embodiments described in thepresent disclosure are merely illustrative of the principles of theembodiments of the present disclosure. Other modifications that may beemployed may be within the scope of the present disclosure. Thus, by wayof example, but not of limitation, alternative configurations of theembodiments of the present disclosure may be utilized in accordance withthe teachings herein. Accordingly, embodiments of the present disclosureare not limited to that precisely as shown and described.

1. A sensing device, comprising: an elastic component; a sensing cavity,wherein the elastic component forms a first sidewall of the sensingcavity; and an energy conversion component configured to obtain asensing signal and convert the sensing signal into an electrical signal,the energy conversion component being in communication with the sensingcavity, and the sensing signal relating to a change of a volume of thesensing cavity, wherein at least one convex structure is arranged on oneside of the elastic component facing toward the sensing cavity, theelastic component driving the at least one convex structure to move inresponse to an external signal, and the movement of the at least oneconvex structure changing the volume of the sensing cavity, wherein theat least one convex structure abuts against a second sidewall of thesensing cavity, the second sidewall is opposite to the first sidewall,the at least one convex structure has elasticity, when the at least oneconvex structure moves, the at least one convex structure producingelastic deformation, and the elastic deformation changing the volume ofthe sensing cavity. 2-5. (canceled)
 6. The sensing device of claim 1,wherein an interval between a pair of adjacent convex structures of theat least one convex structure is 1 μm-2000 μm.
 7. The sensing device ofclaim 1, wherein an interval between a pair of adjacent convexstructures of the at least one convex structure is 10 μm-500 μm.
 8. Thesensing device of claim 1, wherein a height of each of the at least oneconvex structure is 1 μm-1000 μm.
 9. The sensing device of claim 1,wherein a height of each of the at least one convex structure is 10μm-300 μm.
 10. The sensing device of claim 1, wherein the elasticcomponent includes an elastic film and an elastic microstructure layer,and the at least one convex structure is arranged on the elasticmicrostructure layer, the sensing device further including: a mass unitarranged on a surface of the other side of the elastic component, themass unit and the elastic component vibrating together in response tothe external signal; and a shell accommodating the elastic component,the mass unit, the sensing cavity, and the energy conversion component.11. The sensing device of claim 10, wherein the elastic microstructurelayer and the elastic film are made of a same material.
 12. The sensingdevice of claim 10, wherein the elastic microstructure layer and theelastic film are made of different materials.
 13. The sensing device ofclaim 10, wherein a thickness of the elastic film is 0.1 μm-500 μm. 14.The sensing device of claim 10, wherein a thickness of the elastic filmis 1 μm-200 μm.
 15. The sensing device of claim 10, wherein a differencebetween a height of each of the at least one convex structure and aheight of the sensing cavity is within 10%. 16-20. (canceled)
 21. Thesensing device of claim 10, wherein a thickness of the mass unit is 1μm-1000 μm.
 22. The sensing device of claim 10, wherein a thickness ofthe mass unit is 50 μm-500 μm.
 23. The sensing device of claim 10,wherein a resonance frequency of a resonant system formed by the massunit and the elastic component is 1500 Hz-6000 Hz.
 24. The sensingdevice of claim 10, wherein a resonance frequency of a resonant systemformed by the mass unit and the elastic component is 1500 Hz-3000 Hz.25. The sensing device of claim 10, further comprising: another elasticcomponent, the another elastic component and the elastic component beingarranged on two sides of the mass unit symmetrically, and the anotherelastic component being fixedly connected with the shell.
 26. A sensingelement, comprising: an elastic component; and a first sensing cavity,wherein the elastic component forms a first sidewall of the firstsensing cavity, wherein at least one convex structure is arranged on oneside of the elastic component facing toward the first sensing cavity,the elastic component driving the at least one convex structure to movein response to an external signal, and the movement of the at least oneconvex structure changing a volume of the first sensing cavity, whereinthe sensing element is attached to a transducer, the transducer isplaced opposing the elastic component to form a closed sensing cavity,and the transducer converts a volume change of the closed sensing cavityinto an electrical signal. 27-28. (canceled)
 29. A sensing element,comprising: an elastic component; and a sensing cavity, wherein theelastic component forms a first sidewall of the sensing cavity; whereinat least one convex structure is arranged on one side of the elasticcomponent facing toward the sensing cavity, and Young's modulus of theat least one convex structure is 100 kPa-1 MPa, the elastic componentcausing at least one of movement and deformation of the at least oneconvex structure in response to an external signal, and the at least oneof the movement and deformation of the at least one convex structurechanging the volume of the sensing cavity.